Heat sink compounds

Industrial thermal transfer silicone paste

Industrial heat sink compound (thermal grease/paste) is a specialized, thermally conductive material designed to eliminate air gaps between components and heat sinks, maximizing thermal transfer. It is crucial for preventing overheating in industrial electronics, power semiconductors, and, computing. Common types include silicone-based, silicone-free (for sensitive electronics, and thermally conductive metal oxide blends. In some applications, the bonding strength of the thermal grease is required. In this case, engineers need to care about some index regarding shear or peer test on the heatsink’s substrate or do this inspection themselves to qualify the heatsink compound.

Zinc oxide containig heat transfer paste

Industrial heat sink silicone compound (thermal grease/paste) is applied to fill microscopic air gaps between a heat-generating component (e.g., CPU, SCR) and its heat sink, increasing thermal conductivity. Apply a small amount—a „rice grain” or small pea size—to the centre of the clean, dry surface and spread evenly with a tool to form a thin, uniform film before securely mounting the heatsink.

Heat sink compound fills these valleys, providing a continuous thermal path. The compound typically has thermal conductivity 30-40x that of air, dramatically improving heat transfer from the semiconductor device to the heatsink.

PRODUCT	Composition	Solid Lubricants	APPLICATION	PDF
Molylub Wapa 340	PDM Silicone oil / Non-organic	Zinc Oxide	for thermal coupling of electrical – electronic devices to heat sinks.
Molylub Wapa V 6515	Synth Ester oil / Non-organic	Metallic Oxides	For heat dissipation, fills any unevenness, microscopic on mounting surfaces

Reliable and compact power electronics designs must consider thermal transfer. The power losses from semiconductor switching and conduction must be extracted and transferred to heatsinks, which are often constructed of copper or aluminium for their high thermal conductivities. Poorly prepared semiconductor and heatsink mating surfaces can limit the effectiveness of this heat transfer. Machining surfaces smooth and filling air gaps between surfaces are two simple techniques that consistently lower thermal resistance in production environments.

Molylub Wapa silicone heat sink compound paste

Applying our Thermal Paste :

Dispense a small, controlled amount of Molyduval Wapa series paste directly to the centre of the CPU’s IHS using one of the methods listed below. For standard single core CPUs, a pea-sized amount (0.3–0.4 ml) is ideal.
Mount the cooler by placing the heatsink or water block vertically onto the CPU. Avoid twisting or sliding to prevent air bubbles. Tighten mounting screws in a diagonal cross-pattern to ensure even pressure and avoid air bubbles or uneven distribution.
Inspect and clean spills, check for excess paste around the edges. Clean carefully with a lint-free cloth to prevent damage to other components.

We recommend replacing our Molylub Wapa series thermal paste every 3–5 years, or every 2 years for high-performance and overclocked systems. You should also reapply if:

You’ve removed and reseated the cooler.
CPU temps are rising under the same load conditions.
You experience frequent thermal throttling or crashes.
The system operates in a hot or dusty environment.

LED lightening bulp heat sink compound

Consumer Electronics: Laptops, smartphones, gaming consoles, and tablets use heatsinks to cool processors and graphic chips. Efficient cooling is essential for maintaining battery life and device performance.
LED Lighting: LED bulbs and fixtures generate heat that can degrade the light output and reduce lifespan. Heatsinks ensure stable operation and energy efficiency.
Automotive Systems: Heatsinks are crucial in electric vehicles (EVs), engine control units (ECUs), and infotainment systems. They help components survive extreme temperature fluctuations.
Power Electronics: Devices like inverters, rectifiers, and UPS systems handle high voltages and currents, necessitating robust thermal management to avoid failure.
Industrial Equipment: Robotics, sensors, control panels, and PLCs often operate continuously. Heatsinks prevent overheating and minimize downtime due to thermal stress.